Oerlikon HRS Flow will be present at Thin Wall Packaging Conference (TWP) 2023, a premier industry event showcasing the latest advancements in injection molding and hot runner solutions.

As a leading innovator, we will present our cutting-edge technologies designed for thin wall packaging and sustainable applications. You will find us at Tabletop 11, where our expert team will provide insights into our solutions, fostering discussions on the future of packaging.

Why visit Oerlikon HRS Flow at TWP 2023?

• Innovative Solutions: Explore our showcase of state-of-the-art hot runner technologies designed to meet the unique demands of thin wall packaging.
• Expert Insights: Engage with our team of experts who will be on hand to share their knowledge and insights into optimizing your packaging processes for efficiency and sustainability.
• Sustainable Applications: Discover how Oerlikon HRS Flow is leading the way in sustainable packaging solutions. Learn about our commitment to environmentally friendly practices and how we can help you meet your sustainability goals.
• Networking Opportunities: Connect with industry professionals, partners, and fellow enthusiasts. Share ideas, experiences, and explore potential collaborations that can drive your business forward.

Connect with us at TWP 2023 and be part of the conversation shaping the landscape of packaging innovation.

To know more about the event and book your seat: https://bit.ly/3uslM7u